Anomax Invents a Break-Thru High Thermal Dissipation Alumina Dielectric Electronic Substrate
GEORGE TOWN, Malaysia, Jan. 11, 2011 — Anomax Corporation Limited announced the invention of a breakthrough high heat dissipation substrate called Integrated Plated Circuit Heat Sink (IPCHS™). The new technology incorporates an aluminum base with a filled anodized dielectric layer and pl…
