Carsem Announces Extremely Thin MLP

IPOH, Malaysia, Oct. 22, 2009 — Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced that they now offer an extremely thin version of their MLP (Micro Leadframe Package). The current offering, referred to as the X3 package, is a two lead packa…

JEDEC to Host Flash Storage Summit in San Jose, CA

Event to Highlight the Future of Flash Memory
ARLINGTON, Va., March 17, 2009 — Flash Memory technology is widely used for high-density, low-power non-volatile data storage in mobile and PC markets. JEDEC Solid State Technology Association’s upcoming Flash Storage Summit in San Jose, CA…