Contact Information
269 Mt. Hermon RoadSuite 104
Scotts Valley, CA 95066
Phone: (831) 438-6861
Contact: Rick Flowers
Email: rflowers@m.carsems.com.my
Website: http://www.carsem.com
Carsem Company Profile
Carsem is a leading provider of turn-key packaging and test services to the semiconductor industry and offers one of the widest ranges of package & test portfolios in the world. To meet the growing demands of the telecommunications and wireless markets for smaller, faster, thermally-efficient devices, Carsem's portfolio includes several advanced technologies, such as the Micro Leadframe Package (MLP), Small Scale Ball Grid Array (SSBGA), Flip Chip On Leadframe (FCOL) and a SiP (System-in-Package) capability. Carsem also offers a full range of turn-key test services for RF, mixed-signal, linear, digital and power devices. Our factories maintain world-class quality standards, having achieved SAC Level 1, ISO-9001, ISO-14001, QS-9000, TS16949 certifications, and are supported with a global network of sales and engineering support offices. Carsem is a member of the Hong Leong Group with factories located in Ipoh, Malaysia; Suzhou, China; and sales offices across the USA, the UK and Taiwan.News from Carsem:
Carsem Announces Extremely Thin MLP
IPOH, Malaysia, Oct. 22, 2009 — Carsem, a leading provider of turnkey packaging and test services to the semiconductor industry, announced that they now offer an extremely thin version of their MLP (Micro Leadframe Package). The c…